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Potting adhesive manufacturer: physical property requirements and cost performance analysis of LED thermal conductive potting adhesive
Release time: 2020-09-23 17:52:25  Hits: 11

Potting adhesive manufacturers tell you that led thermal conductive potting adhesive has high refractive index and high transmittance, can protect LED chip, increase LED luminous flux, low viscosity, easy to defoamer, suitable for potting and molding, so that led has better durability and reliability.

Tis high thermal conductivity two-component potting silica gel is a kind of two-component, high thermal conductivity, room temperature curable, long working time and fireproof performance. It is especially suitable for filling capacitor and small electronic equipment. Their flexible and elastic properties enable them to be used to cover very uneven surfaces. The heat is transferred from the separation device or the whole PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components. Vulcanized silicone rubber can be divided into elastic led thermal conductive silica gel and silicone rubber, the former has lower strength, the latter has higher strength. It has excellent electrical and chemical stability, water resistance, ozone resistance, weather aging resistance, hydrophobic, moisture-proof, shock proof and non-corruption. Their vulcanization mechanism is based on the addition reaction of vinyl (or propylene) on the end group of silicone rubber and the hydrosilyl group of crosslinking agent molecules.

Definition of thermal conductive epoxy potting adhesive: the commonly seen electronic potting adhesive belongs to liquid colloid, which is not dry before curing, and will be very hard after curing. Its functions of waterproof and moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance and shock resistance are also reflected after curing. Thermal conductive potting adhesive is a kind of two-component, high thermal conductivity, room temperature curing, long working time and fireproof performance. It is especially suitable for filling capacitor and small electronic equipment.

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